Prospects of Thermal Management Techniques in Computer Architecture

Chigozirim Ajaegbu, A.S Sodiya, Shade Kuroyo

Abstract


In all circuit networks, there is a need to balance the amount of heat generated by each circuit component with the power density. Managing the heat generated by electronic elements have always been one of the greatest tasks in any electronic design. Many thermal management techniques of microprocessor have been proposed and implemented for different systems. It was observed that the issue of microprocessor thermal-management needs to be addressed from the basis, that is, the application of the floor planning technique. Also, there is the need to balance the performance measure with the thermal technique in such a way that one needs not to be compromised for another. This paper identifies some of the thermal management techniques proposed by different authors, the gaps and the likely prospects.

 


Full Text:

PDF

References


Hung W. L., Xie Y., Vijaykrishnan N., Addo-Quaye C., Theocharides T., and Irwin M. J. (2006) Interconnect and Thermal-aware Floorplanning for 3D Microprocessors In Proceedings of the 7th International Symposium on Quality Electronic Design (ISQED’06), IEEE Computer Society http://www.cse.psu.edu/~yuanxie/Papers/ISQED05-Hung.pdf

Zhou X., Yang J., Xu Y., Du Y. and Zhang Y. (2008). Thermal Management for 3D Processors via Task Scheduling. In Proceedings of the 37th International Conference on Parallel Processing, (ICPP’08) IEEE Computer Society, 115-122.

Kumar A., Shang L., Peh S., Jha N. (2008). System-Level Dynamic Thermal Management for High-Performance Microprocessors.IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. 27(1), 96-108.

Jeonghwan C.; Chen-Yong C.; Hubertus F.; Hendrik H.; Alan W. and Pradip B. (2007) Thermal-aware Task Scheduling at the system software level In Proceedings of the 2007 international symposium on Low power electronics and design (ISLPED '07), 213-218

Bailis P., Vijay J. R., Sanjay G., David B., and Margot S. (2011) Dimetrodon: processor-level preventive thermal management via idle cycle injection. In Proceedings of the 48th Design Automation Conference (DAC 2011), San Diego, California, 89-94

Yun-Chih C., Yao-Wen C., Guang-Ming W. , and Shu-Wei W. (2000) B*-Trees: a new representation for non-slicing floorplans Proceeding DAC '00 In Proceedings of the 37th Annual Design Automation Conference (DAC’00) pp. 458-463

Schmidt R (2004). Challenges in Electronic Cooling- Opportunities for Enhanced Thermal management Techniques- Microprocessor Liquid Cooled Minichannel Heat Sink. Heat Transfer Engineering. 25(3). 3-12.


Refbacks

  • There are currently no refbacks.


ISSN: 1694-2507 (Print)

ISSN: 1694-2108 (Online)